Corrosion in Electronics at Device Level | Zendy

Morten Stendahl Jellesen | Zendy; Daniel Minzari | Zendy; Umadevi Rathinavelu | Zendy; Per Møller | Zendy; Rajan Ambat | Zendy

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Corrosion in Electronics at Device Level

Author(s) -

Morten Stendahl Jellesen,

Daniel Minzari,

Umadevi Rathinavelu,

Per Møller,

Rajan Ambat

Publication year - 2010

Publication title -

ecs transactions

Language(s) - English

Resource type - Journals

SCImago Journal Rank - 0.235

H-Index - 52

eISSN - 1938-6737

pISSN - 1938-5862

DOI - 10.1149/1.3321952

Subject(s) - soldering , humidity , corrosion , materials science , reliability (semiconductor) , printed circuit board , thermography , electronics , optical microscope , contamination , service life , relative humidity , environmental science , composite material , forensic engineering , metallurgy , electrical engineering , optics , meteorology , engineering , scanning electron microscope , ecology , power (physics) , physics , quantum mechanics , infrared , biology

This work presents device level testing of a lead free soldered electronic device tested with bias on under cyclic humidity conditions in a climatic chamber. Besides severe temperature and humidity during testing some devices were deliberately contaminated before testing. Contaminants investigated are ionic or airborne contaminants likely to be introduced by production or service conditions. The effect of changes in processing parameters as a result of production shift to lead free solder (e.g. higher soldering temperature) has also been investigated. Analysis have shown that one printed circuit board assembly (PCBA) in the device is more prone to corrosion reliability and this was further analysed using thermography to detect areas that have high risk of condensation due to lower temperature under working condition. Tested PCBAs are subjected to detailed investigation before and after testing using high resolution photography, detailed optical microscopy and SEM/EDS.

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