Direct Cu-on-Ta Electroplating from Ionic Liquids in High Vacuum | Zendy

Stijn Schaltin | Zendy; Andrey Shkurankov | Zendy; Koen Binnemans | Zendy; Jan Fransaer | Zendy

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Direct Cu-on-Ta Electroplating from Ionic Liquids in High Vacuum

Author(s) -

Stijn Schaltin,

Andrey Shkurankov,

Koen Binnemans,

Jan Fransaer

Publication year - 2010

Publication title -

ecs transactions

Language(s) - English

Resource type - Journals

SCImago Journal Rank - 0.235

H-Index - 52

eISSN - 1938-6737

pISSN - 1938-5862

DOI - 10.1149/1.3318510

Subject(s) - tantalum , ionic liquid , overpotential , electrolyte , copper , electrochemistry , materials science , electrode , electroplating , ionic bonding , nucleation , ultra high vacuum , inorganic chemistry , vacuum evaporation , deposition (geology) , vapor pressure , evaporation , chemical engineering , analytical chemistry (journal) , chemistry , metallurgy , ion , layer (electronics) , nanotechnology , thin film , catalysis , thermodynamics , engineering , biology , paleontology , biochemistry , chromatography , physics , organic chemistry , sediment

Jan.Fransaer@mtm.kuleuven.be, Tel.: +32 16 32 12 86, Fax: +32 16 32 19 91 Smooth layers of 20 nm of copper have been deposited on a tantalum substrate from ionic liquids under high vacuum conditions. By electrochemical vacuum deposition (EVD) it is possible to achieve extremely low concentrations of oxygen and water, so that the tantalum electrode does not oxidize. Due to the low vapor pressure of ionic liquids, no evaporation of the electrolyte was observed in high vacuum. The wide electrochemical windows of the ionic liquids are advantageous to obtain nucleation densities up to 8 10

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