Effect of Copper Pretreatment on the Double Zincate Process of Aluminum Alloy Films | Zendy

Kazuhisa Azumi | Zendy; Shinnosuke Egoshi | Zendy; Satoshi Kawashima | Zendy; Yuuichi Koyama | Zendy

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Effect of Copper Pretreatment on the Double Zincate Process of Aluminum Alloy Films

Author(s) -

Kazuhisa Azumi,

Shinnosuke Egoshi,

Satoshi Kawashima,

Yuuichi Koyama

Publication year - 2007

Publication title -

journal of the electrochemical society

Language(s) - English

Resource type - Journals

SCImago Journal Rank - 1.258

H-Index - 271

eISSN - 1945-7111

pISSN - 0013-4651

DOI - 10.1149/1.2436992

Subject(s) - zincate , alloy , nucleation , etching (microfabrication) , materials science , deposition (geology) , dissolution , aluminium , copper , metallurgy , tin , sputter deposition , chemical engineering , thin film , sputtering , chemistry , layer (electronics) , composite material , zinc , nanotechnology , paleontology , organic chemistry , sediment , engineering , biology

Etching pretreatment in H2SO4+CuSO4 solution was applied to magnetron sputter-deposited Al–Si alloy films formed on a glass plate to improve uniformity of Zn deposition in the double zincate process. In the etching process, a small amount of Cu was deposited on the alloy surface at a very high density to accompanying Al dissolution. These deposits acted as nucleation seeds for Zn deposition, resulting in uniform, fine and thin Zn layers on Al alloys in a zincate process. This effect was more prominent on Al alloys containing 2.0 or 2.6 atom % of Si than on those containing 0 or 1.0 atom % of Si. Such a discrepancy was caused by increased Cu deposition on Al–Si alloys with relatively high Si concentration.©2007 The Electrochemical Societ

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