Brittle and Ductile Fracture Mechanics Analysis of Surface Damage Caused During CMP | Zendy

Terry A. Ring | Zendy; Paul Feeney | Zendy; David Boldridge | Zendy; Jaishankar Kasthurirangan | Zendy; Shoutian Li | Zendy; James A. Dirksen | Zendy

AI Assistant Blog Pricing

Home ZAIA Blog

Open Access

Brittle and Ductile Fracture Mechanics Analysis of Surface Damage Caused During CMP

Author(s) -

Terry A. Ring,

Paul Feeney,

David Boldridge,

Jaishankar Kasthurirangan,

Shoutian Li,

James A. Dirksen

Publication year - 2007

Publication title -

journal of the electrochemical society

Language(s) - English

Resource type - Journals

SCImago Journal Rank - 1.258

H-Index - 271

eISSN - 1945-7111

pISSN - 0013-4651

DOI - 10.1149/1.2426877

Subject(s) - materials science , brittleness , wafer , chemical mechanical planarization , fracture mechanics , polishing , composite material , fracture (geology) , silicon , brittle fracture , damage mechanics , metallurgy , forensic engineering , structural engineering , finite element method , nanotechnology , engineering

This work reviews the mechanical properties and fracture mechanics of materials important in the manufacture of multilayer interconnects on silicon chips in order to understand surface damage caused during chemical mechanical polishing (CMP). It gives an explanation for chatter marks, surface flaking in interlayer dielectric material, and rolling indenter and plastic plow lines in copper on the wafer surface during CMP of silicon chips.

The content you want is available to Zendy users.

Already have an account? Click here to sign in.

Having issues? You can contact us here

Accelerating Research