Codeposition of α‐Alumina Particles from Acid Copper Sulfate Bath | Zendy

Hidetaka Hayashi | Zendy; Shinya Izumi | Zendy; Isao Tari | Zendy

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Codeposition of α‐Alumina Particles from Acid Copper Sulfate Bath

Author(s) -

Hidetaka Hayashi,

Shinya Izumi,

Isao Tari

Publication year - 1993

Publication title -

journal of the electrochemical society

Language(s) - English

Resource type - Journals

eISSN - 1945-7111

pISSN - 0013-4651

DOI - 10.1149/1.2221051

Subject(s) - copper , adsorption , plating (geology) , zeta potential , particle (ecology) , copper plating , cathode , sulfate , chemistry , particle size , chemical engineering , inorganic chemistry , copper sulfate , materials science , metallurgy , electroplating , nanoparticle , composite material , nanotechnology , layer (electronics) , oceanography , geophysics , engineering , geology

The purpose of this work is to elucidate the factors affecting the codeposition of a-alumina particles with copper froman acid copper sulfate bath. The effect of current density and particle concentration in the bath on the amount of codepositeda-alumina were determined. In order to evaluate the surface-chemical properties of the particles, the zeta-potentialof a-alumina particles in the plating bath was determined by means of the streaming potential method. The amounts ofadsorbed Cu 2+ and SO2( from the plating bath were also determined. The amount of codeposited a-alumina particles wasfound to be greater than those reported in literature, in spite of the negative zeta-potential values of a-alumina. Thisindicates that the electrostatic interaction between the particles and the cathode is not the essential factor of the codepositionprocess. It is considered that the amount of adsorbed Cu 2+ on the a-alumina particle plays an important role in thecodeposition behavior.

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