Open AccessA Model for Copper Electroplating of Multilayer Printed Wiring Boards
Author(s) -
Thomas Kessler,
Richard C. Alkire
Publication year - 1976
Publication title -
journal of the electrochemical society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 1.258
H-Index - 271
eISSN - 1945-7111
pISSN - 0013-4651
DOI - 10.1149/1.2133018
Subject(s) - electroplating , copper , mass transfer , materials science , ohmic contact , diffusion , mechanics , printed circuit board , electrolyte , composite material , thermodynamics , metallurgy , electrical engineering , chemistry , electrode , engineering , physics , layer (electronics)
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