Open AccessMathematical Modeling of Electroplating in High Aspect Ratio Through‐Holes of Multilayer Printed Circuit Boards
Author(s) -
David A. Hazlebeck
Publication year - 1989
Publication title -
journal of the electrochemical society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 1.258
H-Index - 271
eISSN - 1945-7111
pISSN - 0013-4651
DOI - 10.1149/1.2096871
Subject(s) - electroplating , printed circuit board , materials science , optoelectronics , nanotechnology , mechanical engineering , engineering physics , engineering , electrical engineering , layer (electronics)
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