Current Evolution of Electrodeposited Copper Bumps with Photoresist Angle | Zendy

Kazuo Kondo | Zendy; Keisuke Fukui | Zendy

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Current Evolution of Electrodeposited Copper Bumps with Photoresist Angle

Author(s) -

Kazuo Kondo,

Keisuke Fukui

Publication year - 1998

Publication title -

journal of the electrochemical society

Language(s) - English

Resource type - Journals

SCImago Journal Rank - 1.258

H-Index - 271

eISSN - 1945-7111

pISSN - 0013-4651

DOI - 10.1149/1.1838354

Subject(s) - bumping , photoresist , cathode , copper , vortex , overpotential , materials science , current (fluid) , diffusion , chemistry , composite material , mechanics , condensed matter physics , electrode , metallurgy , thermodynamics , physics , electrochemistry , layer (electronics)

We report the current distribution of copper bumps with photoresist sidewall angles. The role of outer diffusion, vortices, and penetration flow within the cavity is discussed, with numerical fluid dynamics computed in order to prevent side bumping. The current distributions were calculated at the diffusion controlled overpotential. The mass transfer-limited current distribution showed that a zero or negative angle reduced diffusion from the outer surroundings and enhanced vortex formation at the cathode corners. Reduction in the diffusion and enhancement in vortices reduced current at the cathode corners and prevented side bumping.

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