Shape Evolution of Electrodeposited Copper Bumps with High Peclet Numbers | Zendy

Kazuo Kondo | Zendy; Keisuke Fukui | Zendy; Mitsunori Yokoyama | Zendy; Kunio Shinohara | Zendy

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Shape Evolution of Electrodeposited Copper Bumps with High Peclet Numbers

Author(s) -

Kazuo Kondo,

Keisuke Fukui,

Mitsunori Yokoyama,

Kunio Shinohara

Publication year - 1997

Publication title -

journal of the electrochemical society

Language(s) - English

Resource type - Journals

SCImago Journal Rank - 1.258

H-Index - 271

eISSN - 1945-7111

pISSN - 0013-4651

DOI - 10.1149/1.1837433

Subject(s) - péclet number , vortex , overpotential , mechanics , materials science , copper , penetration (warfare) , flux (metallurgy) , physics , metallurgy , electrode , quantum mechanics , operations research , engineering , electrochemistry

We report the shape evolution of initial copper bumps at Peclet numbers higher than a hundred. The role of vortices and of penetration flow within the cavity was discussed with numerical fluid dynamics computation to obtain a bump with a single hump at the center. The current distributions, or flux profiles, were calculated at the diffusion controlled overpotential and were compared with the electrodeposited bump shapes. For the 100 mu m cavity width, the vortices increase at the upstream corners with Peclet numbers 1410 and 7311. The vortices are the local resistance of mass transfer to the cathode. These vortices cause the hollows in flux profiles at the upstream corner with these Peclet numbers. The penetration flow collides with the photoresist sidewall and the vortices decrease at downstream corners. These decreased vortices cause the increase in flux profile at downstream corners. For a 30 pm cavity width a single large vortex forms for the higher Peclet number 44,500 and a single hump in flux is achieved.

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