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Characteristics of Top‐Gate Polysilicon Thin‐Film Transistors Fabricated on Fluorine‐Implanted and Crystallized Amorphous Silicon Films
Author(s) -
Chien Kuo Yang,
Tan Fu Lei,
Chung Len Lee
Publication year - 1996
Publication title -
journal of the electrochemical society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 1.258
H-Index - 271
eISSN - 1945-7111
pISSN - 0013-4651
DOI - 10.1149/1.1837202
Subject(s) - thin film transistor , materials science , polysilicon depletion effect , polycrystalline silicon , amorphous solid , passivation , ion implantation , silicon , fluorine , optoelectronics , secondary ion mass spectrometry , amorphous silicon , layer (electronics) , transistor , nanotechnology , crystalline silicon , ion , gate oxide , metallurgy , electrical engineering , chemistry , crystallography , engineering , organic chemistry , voltage
This paper presents a comprehensive study on the characteristics of n- and p-channel polycrystalline-silicon (polysilicon) thin-film transistors (TFTs) fabricated on fluorine-implanted-then-crystallized amorphous silicon films. Amorphous silicon films of two thicknesses were implanted with different energies and various dosages of fluorine, and studied using transmission electron microscopy (TEM) and secondary-ion mass spectrometry (SIMS). The electrical characteristics of TFTs fabricated on the films were correlated with the results of TEM and SIMS. It was found that field-effect mobilities of both n- and p-channel devices were improved by the fluorine implantation thanks to the enhanced grain size and the fluorine passivation effect. For the p-channel device, the fluorine implantation did not improve the subthreshold swing and even degraded it after hydrogenation. This result was thought to be caused by the fluorine-induced negative charges in oxides. However, a thin active layer and a deep implantation reduced this degradation.

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