A 3D EHL Simulation of CMP
Author(s) -
Xiaoqing Jin,
L. M. Keer,
Qian Wang
Publication year - 2004
Publication title -
journal of the electrochemical society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 1.258
H-Index - 271
eISSN - 1945-7111
pISSN - 0013-4651
DOI - 10.1149/1.1823993
Subject(s) - chemical mechanical planarization , lubrication , asperity (geotechnical engineering) , reynolds equation , materials science , mechanics , polishing , contact mechanics , deformation (meteorology) , displacement (psychology) , slurry , mechanical engineering , composite material , finite element method , reynolds number , engineering , structural engineering , physics , psychology , turbulence , psychotherapist
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