Open AccessEffects of Thiourea and Polyoxyethylene Lauryl Ether on Electrodeposition of Sn-Ag-Cu Alloy as a Pb-Free Solder
Author(s) -
Mitsunobu Fukuda,
Kohei Imayoshi,
Yasumichi Matsumoto
Publication year - 2002
Publication title -
journal of the electrochemical society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 1.258
H-Index - 271
eISSN - 1945-7111
pISSN - 0013-4651
DOI - 10.1149/1.1463404
Subject(s) - thiourea , alloy , eutectic system , plating (geology) , materials science , metallurgy , adsorption , copper , ether , electrochemistry , metal , inorganic chemistry , chemistry , organic chemistry , electrode , geology , geophysics
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