Open AccessBenzotriazole as an Additive for Copper Electrodeposition Influence of Triazole Ring Substitution
Author(s) -
T. Y. B. Leung,
Myungchan Kang,
Brian F. Corry,
Andrew A. Gewirth
Publication year - 2000
Publication title -
journal of the electrochemical society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 1.258
H-Index - 271
eISSN - 1945-7111
pISSN - 0013-4651
DOI - 10.1149/1.1393902
Subject(s) - benzotriazole , copper , chemistry , electrochemistry , amide , inorganic chemistry , triazole , deposition (geology) , electroplating , amine gas treating , organic chemistry , layer (electronics) , electrode , paleontology , sediment , biology
Accelerating Research
Robert Robinson Avenue,
Oxford Science Park, Oxford
OX4 4GP, United Kingdom
Address
John Eccles HouseRobert Robinson Avenue,
Oxford Science Park, Oxford
OX4 4GP, United Kingdom