Highly (111) Textured Titanium Nitride Layers for Sub-Quarter-Micrometer Al Metallization | Zendy

Wen Fa Wu | Zendy; Chien-Cheng Lin | Zendy; Chyi Chyuan Huang | Zendy; Horng−Chih Lin | Zendy; TingChang Chang | Zendy; Rong Ping Yang | Zendy; Tiao-Yuan Huang | Zendy

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Highly (111) Textured Titanium Nitride Layers for Sub-Quarter-Micrometer Al Metallization

Author(s) -

Wen Fa Wu,

Chien-Cheng Lin,

Chyi Chyuan Huang,

Horng−Chih Lin,

TingChang Chang,

Rong Ping Yang,

Tiao-Yuan Huang

Publication year - 1999

Publication title -

electrochemical and solid-state letters

Language(s) - Uncategorized

Resource type - Journals

eISSN - 1944-8775

pISSN - 1099-0062

DOI - 10.1149/1.1390830

Subject(s) - materials science , layer (electronics) , sputtering , substrate (aquarium) , electrical resistivity and conductivity , micrometer , nitride , texture (cosmology) , deposition (geology) , optoelectronics , titanium nitride , stack (abstract data type) , vacuum deposition , thin film , composite material , nanotechnology , optics , electrical engineering , artificial intelligence , image (mathematics) , oceanography , computer science , engineering , biology , paleontology , programming language , physics , sediment , geology

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