Open AccessA Superfilling Model that Predicts Bump Formation
Author(s) -
Alan C. West,
S.T. Mayer,
Jonathan Reid
Publication year - 2001
Publication title -
electrochemical and solid-state letters
Language(s) - English
Resource type - Journals
eISSN - 1944-8775
pISSN - 1099-0062
DOI - 10.1149/1.1375856
Subject(s) - adsorption , feature (linguistics) , diffusion , materials science , deposition (geology) , surface (topology) , electrochemistry , surface diffusion , mechanism (biology) , mechanics , chemical physics , statistical physics , thermodynamics , chemistry , geometry , physics , mathematics , geology , quantum mechanics , paleontology , philosophy , linguistics , electrode , sediment
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