Charge Trapping Memory with 2.85-nm Si-Nanoparticles Embedded in HfO2
Author(s) -
Nazek ElAtab,
Berk Berkan Turgut,
Ali K. Okyay,
Ammar Nayfeh
Publication year - 2015
Publication title -
ecs transactions
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.235
H-Index - 52
eISSN - 1938-6737
pISSN - 1938-5862
DOI - 10.1149/06640.0017ecst
Subject(s) - nanoparticle , materials science , trapping , non volatile memory , conduction band , optoelectronics , valence (chemistry) , threshold voltage , high κ dielectric , data retention , hysteresis , nanotechnology , retention time , valence band , voltage , electron , electrical engineering , condensed matter physics , band gap , transistor , chemistry , dielectric , physics , ecology , quantum mechanics , biology , organic chemistry , engineering , chromatography
In this work, the effect of embedding 2.85-nm Si-nanoparticles charge trapping layer in between double layers of high-κ Al2 O3 /HfO2 oxides is studied. Using high frequency (1 MHz) C-Vgate measurements, the memory showed a large memory window at low program/erase voltages due to the charging of the Si-nanoparticles. The analysis of the C-V characteristics shows that mixed charges are being stored in the Si-nanoparticles where electrons get stored during the program operation while holes dominate in the Si-nanoparticles during the erase operation. Moreover, the retention characteristic of the memory is studied by measuring the memory hysteresis in time. The obtained retention characteristic (35.5% charge loss in 10 years) is due to the large conduction and valence band offsets between the Si-nanoparticles and the Al2 O3 /HfO2 tunnel oxide. The results show that band engineering is essential in future low-power non-volatile memory devices. In addition, the results show that Si-nanoparticles are promising in memory applications. © The Electrochemical Society
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