Cooling of integrated circuits using droplet-based microfluidics

Decreasing feature sizes and increasing package densities are making thermal issues extremely important in IC design. Uneven thermal maps and hot spots in ICs cause physical stress and performance degradation. Many MEMS and microfluidics-based solutions were proposed in the past. We present a cooling method based on high-speed electrowetting manipulation of discrete sub-microliter droplets under voltage control with volume flow rates in excess of 10 mL/min. We also propose a flow-rate feedback control where the hot areas get increased supply of droplets without the need for external sensors and electrothermocapillary control where hot areas attract droplets due to thermocapillarity and are returned to their reservoirs by electrowetting resulting in a self-contained and a self-regulated system.