TSV-constrained micro-channel infrastructure design for cooling stacked 3D-ICs | Zendy

Bing Shi | Zendy; Ankur Srivastava | Zendy

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TSV-constrained micro-channel infrastructure design for cooling stacked 3D-ICs

Author(s) -

Bing Shi,

Ankur Srivastava

Publication year - 2012

Publication title -

digital repository at the university of maryland (university of maryland college park)

Language(s) - English

Resource type - Conference proceedings

DOI - 10.1145/2160916.2160941

Subject(s) - channel (broadcasting) , computer cooling , three dimensional integrated circuit , materials science , power (physics) , electronic engineering , computer science , mechanical engineering , optoelectronics , thermal management of electronic devices and systems , electrical engineering , integrated circuit , engineering , physics , quantum mechanics

Micro-channel based liquid cooling has significant capability of removing high density heat in 3D-ICs. The conventional micro-channel structures investigated for cooling 3D-ICs use straight channels. However, the presence of TSVs which form obstacles to the micro-channels prevents distribution of straight micro-channels. In this paper, we investigate the methodology of designing TSV-constrained micro-channel infrastructure. Specifically, we decide the locations and geometry of micro-channels with bended structure so that the cooling effectiveness is maximized. Our micro-channel structure could achieve up to 87% pumping power savings compared with the structure using straight micro-channels.

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