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SOC test-architecture optimization for the testing of embedded cores and signal-integrity faults on core-external interconnects
Author(s) -
Qiang Xu,
Yubin Zhang,
Krishnendu Chakrabarty
Publication year - 2009
Publication title -
acm transactions on design automation of electronic systems
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.266
H-Index - 51
eISSN - 1557-7309
pISSN - 1084-4309
DOI - 10.1145/1455229.1455233
Subject(s) - computer science , interconnection , automatic test pattern generation , embedded system , core (optical fiber) , system on a chip , test compression , signal integrity , design for testing , multi core processor , parallel computing , reliability engineering , testability , electronic circuit , engineering , electrical engineering , computer network , telecommunications
The test time for core-external interconnect shorts and opens is typically much less than that for core-internal logic. Therefore, prior work on test-infrastructure design for core-based system-on-a-chip (SOC) has mainly focused on minimizing the test time for core-internal logic. However, as feature sizes shrink for newer process technologies, the test time for signal integrity (SI) faults on interconnects cannot be neglected. The test time for SI faults can be comparable to, or even larger than, the test time for the embedded cores. We investigate the impact of interconnect SI tests on SOC test-architecture design and optimization. A compaction method for SI faults and algorithms for test-architecture optimization are also presented. Experimental results for the ITC'02 benchmarks show that the proposed approach can significantly reduce the overall testing time for core-internal logic and core-external interconnects.

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