Open AccessCopper–Holmium Alloy Film for Reliable Interconnects
Author(s) -
Chon-Hsin Lin,
W.K. Leau,
Chenghui Wu
Publication year - 2010
Publication title -
japanese journal of applied physics
Language(s) - Uncategorized
Resource type - Journals
SCImago Journal Rank - 0.487
H-Index - 129
eISSN - 1347-4065
pISSN - 0021-4922
DOI - 10.1143/jjap.49.05fa03
Subject(s) - materials science , alloy , annealing (glass) , copper , substrate (aquarium) , electrical resistivity and conductivity , leakage (economics) , thin film , nitride , dielectric , metallurgy , optoelectronics , composite material , nanotechnology , electrical engineering , oceanography , engineering , layer (electronics) , economics , macroeconomics , geology
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