Ferrite and Copper Electroless Plating of Photopolymerized Resin for Micromolding of Three-Dimensional Structures

The electroless plating of ferrite and copper onto photopolymerized resin was investigated with the aim of fabricating three-dimensional microstructures. Evaluation by X-ray diffraction and X-ray fluorescence measurements clarified that the materials were successfully plated onto the resin mold by controlling the temperature and pH of the source solution. High-resolution optical microscope observation revealed that the 2-µm-deep pits at the surface were fully plated by the materials, demonstrating the submicron resolution of the microfabrication process. We performed the transcription of three-dimensional structures made of plated copper from a resin mold, and succeeded in the fabrication of a screw. The 40-µm-thick thread was formed accurately.