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Electrical Characterization of Al/SiNx:H/n and p-In0.53Ga0.47As Structures by Deep-Level Transient Spectroscopy and Conductance Transient Techniques
Author(s) -
Helena Castán,
S. Dueñas,
J. Barbolla,
N Blanco,
I. Mártil,
G. González-Dı́az
Publication year - 2001
Publication title -
japanese journal of applied physics
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.487
H-Index - 129
eISSN - 1347-4065
pISSN - 0021-4922
DOI - 10.1143/jjap.40.4479
Subject(s) - deep level transient spectroscopy , analytical chemistry (journal) , dielectric , annealing (glass) , materials science , conductance , electrical resistivity and conductivity , electron cyclotron resonance , capacitance , chemistry , optoelectronics , condensed matter physics , ion , electrical engineering , silicon , electrode , composite material , physics , organic chemistry , chromatography , engineering
We have analyzed the influence of the dielectric composition and the post deposition rapid thermal annealing (RTA) treatment on the electrical characteristics of electron-cyclotron-resonance plasma-deposited SiNx:H/n and p-In0.53Ga0.47As interfaces. The devices are characterized by means of capacitance-voltage (C-V), deep-level transient spectroscopy (DLTS) and conductance transient analyses. Our results show that a simple cleaning step of the semiconductor surface prior to insulator deposition, and a post deposition RTA process are sufficient to obtain good-quality structures, the n-type being better than the p-type. In both cases, we conclude that a dielectric composition of x = 1.50 seems to be the best choice, and that the most adequate RTA temperature is between 500 degreesC and 600 degreesC

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