HfSe 2 and ZrSe 2 : Two-dimensional semiconductors with native high-κ oxides
Author(s) -
Michal J. Mleczko,
Chaofan Zhang,
Hye Ryoung Lee,
Hsueh-Hui Kuo,
Blanka Magyari-Köpe,
R. G. Moore,
ZhiXun Shen,
I. R. Fisher,
Yoshio Nishi,
Eric Pop
Publication year - 2017
Publication title -
science advances
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 5.928
H-Index - 146
ISSN - 2375-2548
DOI - 10.1126/sciadv.1700481
Subject(s) - semiconductor , materials science , dielectric , silicon , optoelectronics , band gap , transistor , insulator (electricity) , monolayer , silicon on insulator , nanotechnology , engineering physics , voltage , electrical engineering , physics , engineering
The success of silicon as a dominant semiconductor technology has been enabled by its moderate band gap (1.1 eV), permitting low-voltage operation at reduced leakage current, and the existence of SiO2 as a high-quality “native” insulator. In contrast, other mainstream semiconductors lack stable oxides and must rely on deposited insulators, presenting numerous compatibility challenges. We demonstrate that layered two-dimensional (2D) semiconductors HfSe2 and ZrSe2 have band gaps of 0.9 to 1.2 eV (bulk to monolayer) and technologically desirable “high-κ” native dielectrics HfO2 and ZrO2, respectively. We use spectroscopic and computational studies to elucidate their electronic band structure and then fabricate air-stable transistors down to three-layer thickness with careful processing and dielectric encapsulation. Electronic measurements reveal promising performance (on/off ratio > 106; on current, ~30 μA/μm), with native oxides reducing the effects of interfacial traps. These are the first 2D materials to demonstrate technologically relevant properties of silicon, in addition to unique compatibility with high-κ dielectrics, and scaling benefits from their atomically thin nature.
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