Rheological properties and adhesive failure of thin viscoelastic layers
Author(s) -
Alfred J. Crosby,
Kenneth R. Shull,
Y.Y. Lin,
ChungYuen Hui
Publication year - 2002
Publication title -
journal of rheology
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 1.098
H-Index - 107
eISSN - 1520-8516
pISSN - 0148-6055
DOI - 10.1122/1.1428316
Subject(s) - adhesive , materials science , viscoelasticity , composite material , rheology , creep , contact mechanics , layer (electronics) , standard linear solid model , stress (linguistics) , radius , finite element method , structural engineering , linguistics , philosophy , computer security , computer science , engineering
Methods have been developed for measuring the linear viscoelastic properties of thin adhesive layers, and for determining the stress intensity factor characterizing the driving force for adhesive failure. Both methods involve bringing a hemispherical indenter in contact with the adhesive layer while simultaneously monitoring the load, displacement, and radius of contact between the indenter and the adhesive. Dynamic moduli for the adhesive layer are obtained by oscillating the indenter, and the adhesive properties are obtained by pulling the indenter completely out of contact with the adhesive layer. Existing theories of viscoelastic contact mechanics were extended to account for the fact that the adhesive layer thickness is not substantially larger than the contact radius, as is generally assumed. A variety of correction factors were introduced that depend on the ratio of the contact radius to the adhesive layer thickness. These methods were applied to a model adhesive based on an acrylic triblock copolymer. Determination of the time-dependent creep and relaxation functions for this material was simplified by the power-law frequency response of the dynamic moduli. The large stress intensity factors observed were related to a Dugdale model of the cohesive zone at the contact edge.
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