Systematic approach for tolerance analysis of photonic systems | Zendy

Johan Frederik Cornelis van Gurp | Zendy; Marcel Tichem | Zendy; U. Staufer | Zendy

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Systematic approach for tolerance analysis of photonic systems

Author(s) -

Johan Frederik Cornelis van Gurp,

Marcel Tichem,

U. Staufer

Publication year - 2011

Publication title -

proceedings of spie, the international society for optical engineering/proceedings of spie

Language(s) - English

Resource type - Conference proceedings

SCImago Journal Rank - 0.192

H-Index - 176

eISSN - 1996-756X

pISSN - 0277-786X

DOI - 10.1117/12.902756

Subject(s) - indium phosphide , photonics , interposer , cladding (metalworking) , tolerance analysis , computer science , silicon photonics , electronic engineering , system in package , optoelectronics , chip , materials science , engineering , nanotechnology , engineering drawing , gallium arsenide , telecommunications , etching (microfabrication) , layer (electronics) , metallurgy

Passive alignment of photonic components is an assembly method compatible with a high production volume. Its precision performance relies completely on the dimensional accuracies of geometrical alignment features. A tolerance analysis plays a key role in designing and optimizing these passive alignment features. The objective of this paper is to develop a systematic approach for conducting such tolerance analysis, starting with a conceptual package design, setting up the tolerance chain, describing it mathematically and converting the misalignment to a coupling loss probability distribution expressed in dB. The method has successfully been applied to a case study where an indium phosphide (InP) chip is aligned with a TriPleX1 (SiO2 cladding with Si3N4 core) interposer via a silicon optical bench (SiOB)

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