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Paving the way for multiple applications for the 3D-AFM technique in the semiconductor industry
Author(s) -
J. Foucher,
E. Pargon,
M. Martin,
Stéphane Reyné,
C. Dupré
Publication year - 2008
Publication title -
proceedings of spie, the international society for optical engineering/proceedings of spie
Language(s) - English
Resource type - Conference proceedings
SCImago Journal Rank - 0.192
H-Index - 176
eISSN - 1996-756X
pISSN - 0277-786X
DOI - 10.1117/12.772675
Subject(s) - semiconductor industry , semiconductor device fabrication , atomic force microscopy , metrology , fabrication , nanotechnology , semiconductor , process (computing) , silicon , semiconductor device , materials science , computer science , engineering , optoelectronics , wafer , manufacturing engineering , optics , physics , medicine , alternative medicine , pathology , layer (electronics) , operating system

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