Structural integrity of composite laminates with embedded micro-sensors
Author(s) -
Yi Huang,
Sia NematNasser
Publication year - 2007
Publication title -
proceedings of spie, the international society for optical engineering/proceedings of spie
Language(s) - English
Resource type - Conference proceedings
SCImago Journal Rank - 0.192
H-Index - 176
eISSN - 1996-756X
pISSN - 0277-786X
DOI - 10.1117/12.715221
Subject(s) - embedment , materials science , composite number , composite laminates , discontinuity (linguistics) , composite material , stress (linguistics) , finite element method , stress field , stress concentration , structural engineering , fracture mechanics , mathematical analysis , linguistics , philosophy , mathematics , engineering
The study of the mechanical interaction among the host, interface, and a device embedded within a laminated composite is important. Embedding micro-sensors in composite laminates produces material discontinuity around the inclusions. This in turn produces stress concentrations at or near the inclusions. Both 2D plane strain and 3D FEM models are developed to analyze the stress/strain state surrounding the embedded micro-sensors within a unidirectional composite laminate. The objective of the present numerical effort is to take into account the observed resin-rich areas caused by embedment, and to determine their effects on the local stress field around the embedment and the corresponding potential failure modes.
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