Open AccessDemolding strategy to improve the hot embossing throughput
Author(s) -
T. Lévéder,
S. Landis,
Laurent Davoust,
S. Soulan,
N. Chaix
Publication year - 2007
Publication title -
proceedings of spie, the international society for optical engineering/proceedings of spie
Language(s) - English
Resource type - Conference proceedings
SCImago Journal Rank - 0.192
H-Index - 176
eISSN - 1996-756X
pISSN - 0277-786X
DOI - 10.1117/12.711151
Subject(s) - embossing , throughput , mold , wafer , resist , computer science , materials science , quenching (fluorescence) , mechanical engineering , process engineering , nanotechnology , composite material , engineering , telecommunications , physics , layer (electronics) , quantum mechanics , fluorescence , wireless
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