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Benefiting from polarization effects on high-NA imaging
Author(s) -
Bruce W. Smith,
Lena Zavyalova,
Andrew Estroff
Publication year - 2004
Publication title -
proceedings of spie, the international society for optical engineering/proceedings of spie
Language(s) - English
Resource type - Conference proceedings
SCImago Journal Rank - 0.192
H-Index - 176
eISSN - 1996-756X
pISSN - 0277-786X
DOI - 10.1117/12.537266
Subject(s) - optics , lithography , photoresist , polarization (electrochemistry) , immersion lithography , numerical aperture , materials science , resist , photolithography , optoelectronics , physics , nanotechnology , chemistry , wavelength , layer (electronics)
The onset of lithographic technology involving extreme numerical aperture (NA) values introduces critical technical issues that are now receiving particular attention. Projection lithography with NA values above 0.90 is necessary for future generation devices. The introduction of immersion lithography enables even larger angles, resulting in NA values of 1.2 and above. The imaging effects from oblique angles, electric field polarization, optical interference, optical reflection, and aberration can be significant. This paper addresses polarization considerations at critical locations in the optical path of a projection system, namely in the illuminator, at the mask, and in the photoresist. Several issues are addressed including TE and azimuthal polarized illumination, wire grid polarization effects for real thin film mask materials, and multilayer resist AR coatings for high NA and polarization.

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