Interfacing requirements for MEMS components in system-on-chip methodologies | Zendy

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Interfacing requirements for MEMS components in system-on-chip methodologies

Author(s) -

Neil Bergmann

Publication year - 2001

Publication title -

proceedings of spie, the international society for optical engineering/proceedings of spie

Language(s) - English

Resource type - Conference proceedings

SCImago Journal Rank - 0.192

H-Index - 176

eISSN - 1996-756X

pISSN - 0277-786X

DOI - 10.1117/12.449173

Subject(s) - interfacing , microelectromechanical systems , electronics , microelectronics , chip , computer science , very large scale integration , system on a chip , electronic engineering , interface (matter) , engineering , embedded system , electrical engineering , computer hardware , nanotechnology , materials science , bubble , maximum bubble pressure method , parallel computing

Modern VLSI design is moving towards a System-on-Chip design paradigm, where chip design involves the integration of separate macrocells from different manufacturers. This paper explores the obstacles to adopting this same methodology for systems incorporating MEMS components. These obstacles include the technology specific nature of most MEMS devices, interference between MEMS sensors, and the limited electronics device density of mixed MEMS/Microelectronics technologies. It is conjectured that one fruitful avenue for further work is the development of MEMS interface circuits which can be incorporated into a single SoC along with other electronics macrocells, and which then connect to discrete MEMS sensor chips.

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