Linkage design effect on the reliability of surface-micromachined microengines driving a load
Author(s) -
Danelle M. Tanner,
Kenneth A. Peterson,
Lloyd W. Irwin,
Paiboon Tangyunyong,
William M. Miller,
William P. Eaton,
Norman F. Smith,
M.S. Rodgers
Publication year - 1998
Publication title -
proceedings of spie, the international society for optical engineering/proceedings of spie
Language(s) - English
Resource type - Conference proceedings
SCImago Journal Rank - 0.192
H-Index - 176
eISSN - 1996-756X
pISSN - 0277-786X
DOI - 10.1117/12.324060
Subject(s) - linkage (software) , reliability (semiconductor) , actuator , stress (linguistics) , fatigue testing , structural engineering , engineering , materials science , physics , electrical engineering , chemistry , power (physics) , quantum mechanics , gene , linguistics , philosophy , biochemistry
The reliability of microengines is a function of the de- sign of the mechanical linkage used to connect the electro- static actuator to the drive. We have completed a series of reliability stress tests on surface micromachined microengi- nes driving an inertial load. In these experiments, we used microengines that had pin mechanisms with guides connect- ing the drive arms to the electrostatic actuators. Comparing this data to previous results 1 using flexure linkages revealed that the pin linkage design was less reliable. The devices were stressed to failure at eight frequencies, both above and below the measured resonance frequency of the microengine. Significant amounts of wear debris were observed both around the hub and pin joint of the drive gear. Additionally, wear tracks were observed in the area where the moving shuttle rubbed against the guides of the pin linkage. At each frequency, we analyzed the statistical data yielding a lifetime (t50) for median cycles to failure and σ, the shape parameter of the distribution. A model was developed to describe the failure data based on fundamental wear mechanisms and forces exhibited in mechanical resonant systems. The com- parison to the model will be discussed.
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