Open Access<title>Flip-chip-joined 8x8 array of bottom-emitting 850-nm light-emitting diodes for interconnect applications</title>
Author(s) -
Paul Heremans,
Patrick Merken,
Jan Genoe,
Reiner Windisch,
Chris Van Hoof,
Gustaaf Borghs
Publication year - 1998
Publication title -
proceedings of spie, the international society for optical engineering/proceedings of spie
Language(s) - English
Resource type - Conference proceedings
SCImago Journal Rank - 0.192
H-Index - 176
eISSN - 1996-756X
pISSN - 0277-786X
DOI - 10.1117/12.307579
Subject(s) - optoelectronics , flip chip , materials science , diode , light emitting diode , quantum efficiency , interconnection , substrate (aquarium) , silicon , chip , electrical engineering , nanotechnology , computer science , engineering , telecommunications , oceanography , adhesive , layer (electronics) , geology
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