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<title>Feature analysis and classification of manufacturing signatures based on semiconductor wafer maps</title>
Author(s) -
Kenneth W. Tobin,
Shaun S. Gleason,
Thomas P. Karnowski,
Susan L. Cohen
Publication year - 1997
Publication title -
proceedings of spie, the international society for optical engineering/proceedings of spie
Language(s) - English
Resource type - Conference proceedings
SCImago Journal Rank - 0.192
H-Index - 176
eISSN - 1996-756X
pISSN - 0277-786X
DOI - 10.1117/12.271241
Subject(s) - computer science , wafer , semiconductor device fabrication , classifier (uml) , data mining , pattern recognition (psychology) , feature selection , wafer fabrication , artificial intelligence , segmentation , oak ridge national laboratory , feature extraction , feature (linguistics) , fuzzy logic , engineering , electrical engineering , linguistics , philosophy , physics , nuclear physics

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