Open AccessWafer-level vacuum sealing for packaging of silicon photonic MEMS
Author(s) -
Gaehun Jo,
Pierre Edinger,
Simon J. Bleiker,
Xiaojing Wang,
Alain Yuji Takabayashi,
Hamed Sattari,
Niels Quack,
Moises A. Jezzini de Anda,
Peter Verheyen,
Göran Stemme,
Wim Bogaerts,
Kristinn B. Gylfason,
Frank Niklaus
Publication year - 2021
Publication title -
ghent university academic bibliography (ghent university)
Language(s) - English
Resource type - Conference proceedings
DOI - 10.1117/12.2582975
Subject(s) - microelectromechanical systems , photonics , silicon photonics , wafer , materials science , silicon on insulator , optoelectronics , wafer bonding , wafer level packaging , silicon
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