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Suspended photonic waveguide arrays for submicrometer alignment
Author(s) -
Tjitte-Jelte Peters,
Marcel Tichem,
U. Staufer
Publication year - 2014
Publication title -
proceedings of spie, the international society for optical engineering/proceedings of spie
Language(s) - English
Resource type - Conference proceedings
SCImago Journal Rank - 0.192
H-Index - 176
eISSN - 1996-756X
pISSN - 0277-786X
DOI - 10.1117/12.2052430
Subject(s) - fabrication , microelectromechanical systems , materials science , photonics , waveguide , deflection (physics) , optics , photonic integrated circuit , optoelectronics , curvature , actuator , beam (structure) , dry etching , etching (microfabrication) , nanotechnology , physics , computer science , layer (electronics) , medicine , alternative medicine , geometry , mathematics , pathology , artificial intelligence
This paper presents a new alignment concept for the alignment of multichannel photonic intergrated circuits (PICs) using flexible photonic waveguides on one of the PICs that are positionable by integrated micro electro mechanical system (MEMS) actuators. The concept aims for high precision and high degree of assembly process automation. The proposed concept includes pre-alignment of both PICs on a common substrate followed by fine-alignment using the on-chip flexible waveguides and MEMS functionality. This paper introduces the alignment approach and reports on the development and fabrication of suspended and mechanically flexible photonic waveguides. Single suspended waveguide beams and suspended arrays with two and four coupled parallel waveguide beams of different lengths (250 ?mto 1000 ?m) and different widths (18 ?mto 34 ?m) are designed and fabricated. After fabrication, waveguide beam fracturing is observed. The fabrication process has been extended by an additional under-etching step in order to reduce beam fracturing. The static out-of-plane deflection of the fabricated devices follows a specific profile with a dominating upward curvature resulting in a measured maximum out-of-plane deflection of 2% of the length. The beam stiffness of the fabricated devices is measured and proves to be within the available force of microactuators

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