Electromechanical behavior of the curled cantilever beam
Author(s) -
Wan-Chun Chuang,
YuhChung Hu,
ChiYuan Lee,
WenPin Shih,
PeiZen Chang
Publication year - 2009
Publication title -
journal of micro/nanolithography mems and moems
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.394
H-Index - 42
eISSN - 1932-5134
pISSN - 1932-5150
DOI - 10.1117/1.3158355
Subject(s) - cantilever , wafer , beam (structure) , microelectromechanical systems , capacitance , boundary value problem , modulus , voltage , work (physics) , materials science , stress (linguistics) , mechanics , acoustics , computer science , mechanical engineering , physics , optics , mathematical analysis , mathematics , engineering , optoelectronics , electrical engineering , composite material , linguistics , philosophy , electrode , quantum mechanics
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