Experimental reliability study of cumulative damage models on state-of-the-art semiconductor technologies for step-stress tests and mission profile stresses | Zendy

A. Hirler | Zendy; Josef Biba | Zendy; D. Lipp | Zendy; H. Lochner | Zendy; M. Siddabathula | Zendy; Steven Simon | Zendy; T. Sulima | Zendy; Maciej Wiatr | Zendy; W. Hänsch | Zendy

Open Access

Experimental reliability study of cumulative damage models on state-of-the-art semiconductor technologies for step-stress tests and mission profile stresses

Author(s) -

A. Hirler,

Josef Biba,

D. Lipp,

H. Lochner,

M. Siddabathula,

Steven Simon,

T. Sulima,

Maciej Wiatr,

W. Hänsch

Publication year - 2020

Publication title -

journal of vacuum science and technology b nanotechnology and microelectronics materials processing measurement and phenomena

Language(s) - English

Resource type - Journals

eISSN - 2166-2754

pISSN - 2166-2746

DOI - 10.1116/6.0000504

Subject(s) - reliability (semiconductor) , reliability engineering , stress (linguistics) , accelerated life testing , capacitor , materials science , semiconductor device , random variable , computer science , voltage , engineering , electrical engineering , statistics , mathematics , composite material , physics , weibull distribution , linguistics , power (physics) , philosophy , layer (electronics) , quantum mechanics

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