Simulations of trench-filling profiles under ionized magnetron sputter metal deposition | Zendy

Satoshi Hamaguchi | Zendy; S. M. Rossnagel | Zendy

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Simulations of trench-filling profiles under ionized magnetron sputter metal deposition

Author(s) -

Satoshi Hamaguchi,

S. M. Rossnagel

Publication year - 1995

Publication title -

journal of vacuum science and technology b microelectronics and nanometer structures processing measurement and phenomena

Language(s) - English

Resource type - Journals

eISSN - 1520-8567

pISSN - 1071-1023

DOI - 10.1116/1.587995

Subject(s) - trench , sputter deposition , materials science , deposition (geology) , sputtering , argon , etching (microfabrication) , ionization , high power impulse magnetron sputtering , cavity magnetron , plasma , metal , thin film , optoelectronics , analytical chemistry (journal) , atomic physics , ion , metallurgy , composite material , nanotechnology , chemistry , layer (electronics) , geology , physics , paleontology , organic chemistry , quantum mechanics , sediment , chromatography

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