Open AccessFast ultra-deep silicon cavities: Toward isotropically etched spherical silicon molds using an ICP-DRIE
Author(s) -
Étienne Herth,
Maciej Barański,
Djaffar Berlharet,
Samson Edmond,
David Bouville,
Laurie E. Calvet,
Christophe Gorecki
Publication year - 2019
Publication title -
journal of vacuum science and technology b nanotechnology and microelectronics materials processing measurement and phenomena
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.429
H-Index - 119
eISSN - 2166-2754
pISSN - 2166-2746
DOI - 10.1116/1.5081503
Subject(s) - deep reactive ion etching , materials science , etching (microfabrication) , reactive ion etching , silicon , undercut , wafer , inductively coupled plasma , dry etching , isotropy , optoelectronics , optics , nanotechnology , plasma , composite material , physics , layer (electronics) , quantum mechanics
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