Area selective deposition of TiO2 by intercalation of plasma etching cycles in PEALD process: A bottom up approach for the simplification of 3D integration scheme | Zendy

R. Vallat | Zendy; R. Gassilloud | Zendy; O. Salicio | Zendy; Khalil El Hajjam | Zendy; G. Molas | Zendy; Bernard Pélissier | Zendy; C. Vallée | Zendy

Open Access

Area selective deposition of TiO2 by intercalation of plasma etching cycles in PEALD process: A bottom up approach for the simplification of 3D integration scheme

Author(s) -

R. Vallat,

R. Gassilloud,

O. Salicio,

Khalil El Hajjam,

G. Molas,

Bernard Pélissier,

C. Vallée

Publication year - 2019

Publication title -

journal of vacuum science and technology a vacuum surfaces and films

Language(s) - English

Resource type - Journals

SCImago Journal Rank - 0.583

H-Index - 112

eISSN - 1520-8559

pISSN - 0734-2101

DOI - 10.1116/1.5049361

Subject(s) - atomic layer deposition , substrate (aquarium) , materials science , tin , x ray photoelectron spectroscopy , fluorine , passivation , deposition (geology) , etching (microfabrication) , layer (electronics) , oxide , chemical engineering , analytical chemistry (journal) , inorganic chemistry , nanotechnology , chemistry , metallurgy , paleontology , oceanography , chromatography , sediment , engineering , biology , geology

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