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Sub-10 nm plasma nanopatterning of InGaAs with nearly vertical and smooth sidewalls for advanced n-fin field effect transistors on silicon
Author(s) -
Fares Chouchane,
B. Salem,
Guillaume Gay,
M. Martin,
E. Pargon,
F. Bassani,
S. Arnaud,
Sylvain David,
Reynald Alcotte,
S. Labau,
Jérémy Moeyart,
T. Baron
Publication year - 2017
Publication title -
journal of vacuum science and technology b nanotechnology and microelectronics materials processing measurement and phenomena
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.429
H-Index - 119
eISSN - 2166-2754
pISSN - 2166-2746
DOI - 10.1116/1.4975796
Subject(s) - materials science , etching (microfabrication) , silicon , fin , optoelectronics , plasma , inductively coupled plasma , reactive ion etching , enhanced data rates for gsm evolution , dry etching , plasma etching , surface finish , nanotechnology , layer (electronics) , physics , composite material , computer science , quantum mechanics , telecommunications

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