Bond contribution model for the prediction of glass transition temperature in polyphenol molecular glass resists
Author(s) -
Richard A. Lawson,
Wei-Ming Yeh,
Clifford L. Henderson
Publication year - 2009
Publication title -
journal of vacuum science and technology b microelectronics and nanometer structures processing measurement and phenomena
Language(s) - English
Resource type - Journals
eISSN - 1520-8567
pISSN - 1071-1023
DOI - 10.1116/1.3250264
Subject(s) - resist , glass transition , materials science , lithography , dewetting , nanotechnology , polymer , composite material , thin film , optoelectronics , layer (electronics)
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