Open AccessIntegrated Avionics System (IAS): Integrating 3D Technology on a Spacecraft Panel
Author(s) -
Don Hunter
Publication year - 2003
Publication title -
2003 international electronic packaging technical conference and exhibition, volume 1
Language(s) - English
Resource type - Conference proceedings
DOI - 10.1115/ipack2003-35249
Subject(s) - avionics , spacecraft , interconnectivity , modular design , embedded system , flexibility (engineering) , scalability , system integration , aerospace , systems engineering , packaging engineering , modularity (biology) , computer science , engineering , component (thermodynamics) , aerospace engineering , mechanical engineering , operating system , statistics , physics , thermodynamics , mathematics , artificial intelligence , biology , genetics
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