Open AccessAnalytical Thermal Model of a Generic Multi-Layer Spacerless 3D Package
Author(s) -
Nuwan Rodrigo,
Saeed Ghalambor,
A. HajiSheikh,
Dereje Agonafer
Publication year - 2011
Publication title -
volume 11: nano and micro materials, devices and systems; microsystems integration
Language(s) - English
Resource type - Conference proceedings
DOI - 10.1115/imece2011-64608
Subject(s) - stacking , die (integrated circuit) , quad flat no leads package , computation , computer science , package on package , system in package , layer (electronics) , integrated circuit packaging , mechanical engineering , r package , engineering drawing , computational science , materials science , integrated circuit , engineering , chip , composite material , operating system , algorithm , telecommunications , wafer dicing , physics , adhesive , nuclear magnetic resonance
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