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Optimization of Chemical Etching Process in Niobium Cavities
Author(s) -
Mohamed B. Trabia,
William Culbreth,
Satishkumar Subramanian,
T. Tajima
Publication year - 2004
Publication title -
osti oai (u.s. department of energy office of scientific and technical information)
Language(s) - English
Resource type - Conference proceedings
DOI - 10.1115/detc2004-57133
Subject(s) - baffle , etching (microfabrication) , isotropic etching , materials science , polishing , niobium , flow visualization , computational fluid dynamics , process (computing) , flow (mathematics) , mechanical engineering , optics , computer science , mechanics , nanotechnology , composite material , physics , engineering , layer (electronics) , metallurgy , operating system
Superconducting niobium cavities are important components of linear accelerators. Buffered chemical polishing (bcp) on the inner surface of the cavity is a standard procedure to improve its performance. The quality of bcp, however, has not been optimized well in terms of the uniformity of surface smoothness. A finite element computational fluid dynamics (cfd) model was developed to simulate the chemical etching process inside the cavity. The analysis confirmed the observation of other researchers that the sections closer to the axis of the cavity received more etching than other regions. A baffle was used by lanl personnel to direct the flow of the etching fluid toward the walls of the cavity. A new baffle design was tined using optimization techniques. The redesigned baffle significantly improves the performance of the etching process. To verify these results an experimental setup for flow visualization was created. The setup consists of a high speed, high resolution ccd camera. The camera is positioned by a computer-controlled traversing mechanism. A dye injecting arrangement is used for tracking the fluid path. Experimental results are in general agreement with computational findings.

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