Open AccessErratum: “Effect of Temperature and Strain Rate on Mechanical Properties of 63Sn/37Pb Solder Alloy” [ASME J. Electron. Packag., 121, pp. 179–185]
Author(s) -
Xu Shi,
Wei Zhou,
and H. L. J. Pang,
Z. P. Wang
Publication year - 2000
Publication title -
journal of electronic packaging
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.523
H-Index - 52
eISSN - 1528-9044
pISSN - 1043-7398
DOI - 10.1115/1.483136
Subject(s) - soldering , materials science , alloy , strain (injury) , composite material , strain rate , metallurgy , thermodynamics , condensed matter physics , physics , medicine
[S1043-7398(00)01601-7]
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