Mechanical Analysis of Electronic Packaging Systems
Author(s) -
Stephen McKeown,
Anthony J. Rafanelli
Publication year - 2000
Publication title -
journal of electronic packaging
Language(s) - Uncategorized
Resource type - Journals
SCImago Journal Rank - 0.523
H-Index - 52
eISSN - 1528-9044
pISSN - 1043-7398
DOI - 10.1115/1.483132
Subject(s) - electronic packaging , materials science , integrated circuit packaging , stress (linguistics) , mechanical engineering , integrated circuit , engineering , composite material , optoelectronics , linguistics , philosophy
[S1043-7398(00)01301-3]
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