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Special Issue on InterPACK2020
Author(s) -
Jin Yang,
Sukwon Choi,
Jaeho Lee,
Saket Karajgikar
Publication year - 2021
Publication title -
journal of electronic packaging
Language(s) - Uncategorized
Resource type - Journals
SCImago Journal Rank - 0.523
H-Index - 52
eISSN - 1528-9044
pISSN - 1043-7398
DOI - 10.1115/1.4053122
Subject(s) - electronics , engineering , microelectronics , automotive industry , photonics , aerospace , manufacturing engineering , publication , electrical engineering , telecommunications , materials science , business , optoelectronics , aerospace engineering , advertising

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