Open AccessGuest Editorial: Interpack 2019
Author(s) -
Sreekant Narumanchi,
Sukwon Choi,
Saket Karajgikar,
Haiding Sun,
Guangsheng Zhang
Publication year - 2020
Publication title -
journal of electronic packaging
Language(s) - Uncategorized
Resource type - Journals
SCImago Journal Rank - 0.523
H-Index - 52
eISSN - 1528-9044
pISSN - 1043-7398
DOI - 10.1115/1.4048039
Subject(s) - materials science , mechanical engineering , mechanics , engineering , physics
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