Open AccessSpecial Issue on InterPACK 2018
Author(s) -
Ercan M. Dede,
Lauren Boteler,
Changqing Chen,
Przemyslaw Jakub Gromala,
Benjamin J. Leever,
Wei Li
Publication year - 2019
Publication title -
journal of electronic packaging
Language(s) - Uncategorized
Resource type - Journals
SCImago Journal Rank - 0.523
H-Index - 52
eISSN - 1528-9044
pISSN - 1043-7398
DOI - 10.1115/1.4043484
Subject(s) - electronics , engineering , packaging engineering , thermal management of electronic devices and systems , manufacturing engineering , systems engineering , mechanical engineering , electrical engineering
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